ZDS-FG2120
ZDS-FG2120 High-Temperature Inorganic Structural Adhesive
ZDS-FG2120 bonds refractory, ceramic, glass-lined and pipeline equipment. Its inorganic formulation suits high-temperature service and chemical media exposure.
Product overview
High-temperature component bonding
ZDS-FG2120 is an inorganic structural adhesive for bonding furnace and refractory components, ceramic and glass-lined equipment, and industrial pipelines. It is intended for prepared contact areas where the bonded assembly will see demanding heat.
Its high-temperature service capability and resistance to chemical media help match the adhesive to hot equipment and aggressive fluid exposure. Review the operating temperature, fluid conditions and access to the bond area before selecting it.
Key material properties
- Chemical resistance: Identify the fluid, concentration and temperature when discussing suitability.
- Temperature capability: Compare the service-temperature limits in the table with the operating conditions.
- Barrier protection: The fluid and exposure conditions matter when selecting the protective material.
Evaluate the material
ZDS-FG2120 technical specifications
| Property | Value / conditions |
|---|---|
| Product model | ZDS-FG2120 |
| Product series | ZDS-FluidGlide |
| Product family | High-temperature & chemical service |
| Substrates and equipment | Furnace and refractory components, ceramic and glass-lined equipment, industrial pipelines |
| Form and color | Adhesive; Typical: Dark grey |
| Working time at 25°C | Typical: 30-45 min |
| Initial cure at 25°C | Typical: 4-6 h |
| Full cure / cure conditions | Heat cure required |
| Service temperature | -60 to 1000°C |
| Recommended application temperature | Recommended: 15°C to 35°C |
| Recommended application thickness | Recommended: 3-8 mm |
Questions about your operating conditions?
Applications
Bonding furnace and refractory components
ZDS-FG2120 bonds furnace and refractory components where the joint must suit high-temperature service. Its inorganic adhesive form is a practical fit when the bonded area will face elevated operating temperatures.
Bonding ceramic, glass-lined and pipeline equipment
Use ZDS-FG2120 for suitable bonding areas on ceramic and glass-lined equipment or industrial pipelines. Consider the contact area, access for preparation and the chemical media that may reach the bond.
Prepare the work surface
Prepare the bonding area using the product-specific preparation instructions.
- Identify the contact surfaces and inspect for loose material and contamination.
- Arrange access to the full work area and the tools needed for the next step.
- Address contamination using the preparation method specified for this product and the actual surface.
Plan the work
Application and cure planning
- Prepare the bonding area and arrange access and tools before starting.
- Mix the components according to the product instructions after surface preparation and setup are complete.
- Apply the adhesive to the prepared contact area according to the product instructions.
- Use the technical table to plan the cure stages. Follow the applicable repair or application procedure for handling, loading and return to service.
Product selection questions
How much working time is available?
The typical working time at 25°C is 30-45 min. Complete surface preparation and setup before mixing.
What is the full-cure schedule?
Full cure: Heat cure required. Follow the product instructions for the applicable cure conditions.
What temperatures apply?
Recommended application temperature: 15°C to 35°C. Service temperature: -60 to 1000°C. Application and service temperatures describe different conditions.
What thickness is recommended?
Recommended: 3-8 mm. Use the stated thickness type and range when planning the work.